SUMRUNRONNASAK, Sarocha, Supawan TANTAYANON, and Somchai KIATGAMOLCHAI. “Corrective Estimation of Copper Deposition Density onto Stainless Steel Substrate by Electroplating”. Walailak Journal of Science and Technology (WJST) 14, no. 5 (June 16, 2016): 369–376. Accessed July 19, 2026. https://wjst.wu.ac.th/index.php/wjst/article/view/1959.