SUMRUNRONNASAK, S., TANTAYANON, S. and KIATGAMOLCHAI, S. (2016) “Corrective Estimation of Copper Deposition Density onto Stainless Steel Substrate by Electroplating”, Walailak Journal of Science and Technology (WJST), 14(5), pp. 369–376. Available at: https://wjst.wu.ac.th/index.php/wjst/article/view/1959 (Accessed: 28April2024).