ABU GHAZAL, A. .; ALKHDOUR, S. .; HUSEIN, Y. .; SURIN, V. .; AL-MALKAWI, G. .; BULBUL, R. .; SHATNAWI, K. . Study of the Contact Thermal Compression Behavior of Copper using Scanning Contact Potentiometry Method and Finite Element Analysis. Walailak Journal of Science and Technology (WJST), [S. l.], v. 18, n. 16, p. Article 22795 (14 pages), 2021. DOI: 10.48048/wjst.2021.22795. Disponível em: https://wjst.wu.ac.th/index.php/wjst/article/view/22795. Acesso em: 25 apr. 2024.