SUMRUNRONNASAK, S.; TANTAYANON, S.; KIATGAMOLCHAI, S. Corrective Estimation of Copper Deposition Density onto Stainless Steel Substrate by Electroplating. Walailak Journal of Science and Technology (WJST), [S. l.], v. 14, n. 5, p. 369–376, 2016. Disponível em: https://wjst.wu.ac.th/index.php/wjst/article/view/1959. Acesso em: 27 apr. 2024.