Study of the Contact Thermal Compression Behavior of Copper using Scanning Contact Potentiometry Method and Finite Element Analysis


  • Ayman ABU GHAZAL Material Testing Laboratory, Research Laboratories and Information Directorate, Nuclear Sciences and Applications Sector, Jordan Atomic Energy Commission, Amman 11934, Jordan
  • Sara ALKHDOUR Nuclear Engineering Department, Jordan University of Science and Technology, Irbid 22110, Jordan
  • Yousef HUSEIN Nuclear Safety and Licensing Directorate, Jordan Research and Training Reactor, Jordan Atomic Energy Commission, Irbid 22110, Jordan
  • Vitaly SURIN Electrophysical Diagnostics and Non-Destructive Testing Laboratory, Nuclear Physics and Technology Institute, National Research Nuclear University MEPhI, Moscow 115531, Russia
  • Ghadeer AL-MALKAWI Nuclear Engineering Department, Jordan University of Science and Technology, Irbid 22110, Jordan
  • Raed BULBUL Research and Development Department, Elite-Glass Industrial Company, King Abdullah II Design and Development Bureau, Amman 2113, Jordan
  • Khaled SHATNAWI Mechanical Engineering Department, Jordan University of Science and Technology, Irbid 22110, Jordan



Compression test, Finite element analysis, Copper, Residual stresses, Scanning contact Potentiometry method


The issue of tracking residual stresses initiation in welding copper under various affected conditions is essential in increasing safety through improving the welding quality in particular, in the nuclear industry. This study investigated the behavior of welded copper numerically and experimentally under contact-heating compression test with constant clamping force. The scanning contact potentiometry (SCP) method was used to track the initiation and development of residual stresses within the weld zone. Furthermore, the finite element analysis (FEA) method was used to simulate and study the effect of thermal variations, with a constant compressive force, on mechanical factors that contribute to residual stresses formation within the weld zone. Additionally, scanning electron microscope (SEM) and energy-dispersive X-ray spectroscopy (EDS) were used to get further information about the topography and composition of the specimen's surface. SCP results show that residual stress initiated from within the volume after 200 °C, and with further oxidation, its formation began on the surface after 250 °C. Using the relationship between maximum values of linearized von Mises stresses and maximum values of ADS at high SLS = 4.523, it was found that residual stresses generation began after 150 °C within the weld zone, and thermal stresses linearly increase with temperature due to further thermal expansion, which is associated with variation in linearized von Mises stresses and ADS maximum values. Comparison between potentiograms after 300 °C and FEA results have shown that the distribution of von Mises stress, normal stress, and total deformation are matching those in the distribution of ADS and are localized within the weld zone.


  • The behavior of welded copper under compression at medium-low temperature range
  • Residual stresses detection at an early stage localized within weldment zone
  • Residual stresses increase with increased oxidation at copper surface
  • Matched the SCP Experimental and FEA simulation results



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How to Cite

ABU GHAZAL, A. ., ALKHDOUR, S. ., HUSEIN, Y. ., SURIN, V. ., AL-MALKAWI, G. ., BULBUL, R. ., & SHATNAWI, K. . (2021). Study of the Contact Thermal Compression Behavior of Copper using Scanning Contact Potentiometry Method and Finite Element Analysis. Walailak Journal of Science and Technology (WJST), 18(16), Article 22795 (14 pages).