Corrective Estimation of Copper Deposition Density onto Stainless Steel Substrate by Electroplating

Authors

  • Sarocha SUMRUNRONNASAK Graduate Program of Petrochemistry and Polymer Science, Faculty of Science, Chulalongkorn University, Bangkok 10330
  • Supawan TANTAYANON Green Chemistry Research Laboratory, Department of Chemistry, Faculty of Science, Chulalongkorn University, Bangkok 10330
  • Somchai KIATGAMOLCHAI Department of Physics, Faculty of Science, Chulalongkorn University, Bangkok 10330

Keywords:

Copper electroplating, deposition density, density estimation, amorphous, stainless steel substrate

Abstract

Deposition patterns and density calculation of the copper (Cu) electroplating from CuSO4 solution onto stainless steel substrate were studied in order to gain better understanding of the relationship between correlated structures and their properties. Square non-porous stainless steel disks (316L SS), having a dimension of 1×1 cm, with a thickness of 1 mm, were used as the substrate. The electroplating system consisted of a Cu bar as the anode and 25 wt% CuSO4 plating solution. A potential of 2.0 volts was applied for the Cu plating at room temperature. The amount of the deposited Cu was determined by measurement of its weight increment. Layer thickness was obtained from the Scanning Electron Microscope (SEM) micrograph analysis. Density estimation of the deposited Cu was calculated from the mass difference and volume of plated layer, as described. Total Cu atoms using Faraday’s equation was used to obtain the theoretical density estimation. The density gradually decreased with the increasing thickness, suggesting that the Cu atoms deposited onto the growing nucleation were less packed at a longer period of plating time. Additionally, the rate of thickness increasing was higher over a longer time. It is believed that void formation was presented in the later state of the coagulation, in which complexity in nucleation growth occurred.

Downloads

Download data is not yet available.

Metrics

Metrics Loading ...

Author Biographies

Sarocha SUMRUNRONNASAK, Graduate Program of Petrochemistry and Polymer Science, Faculty of Science, Chulalongkorn University, Bangkok 10330

Graduate Program of Petrochemistry and Polymer Science, Faculty of Science

Supawan TANTAYANON, Green Chemistry Research Laboratory, Department of Chemistry, Faculty of Science, Chulalongkorn University, Bangkok 10330

Green Chemistry Research Laboratory, Department of Chemistry, Faculty of Science

Somchai KIATGAMOLCHAI, Department of Physics, Faculty of Science, Chulalongkorn University, Bangkok 10330

Department of Physics, Faculty of Science

References

J Tosques, MH Martin, L Roué and D Guay. Hydrogen solubility in PdCuAg ternary alloy films prepared by electrodeposition. Int. J. Hydrogen Energ. 2014; 39, 15810-8.

C Ling, L Semidey-Flecha and DS Sholl. First-principles screening of PdCuAg ternary alloys as H2 purification membranes. J Membr. Sci.2011; 371,189-96.

BH Guerreiro, MH Martin, L Roué and D Guay. Hydrogen solubility in PdCuAu alloy thin films prepared by electrodeposition. Int. J. Hydrogen Energ. 2014; 39, 3487-97.

F Qiao and AC West. The impact of cations on nucleus density during copper electrodeposition. Electrochim. Acta 2014; 150, 8-14.

D Grujicic and B Pesic. Electrodeposition of copper: The nucleation mechanisms. Electrochim. Acta 2002; 47, 2901-12.

J Mao, E Eisenbraun, V Omarjee, A Korolev and C Dussarrat. Scaling of copper seed layer thickness using plasma-enhanced ALD and optimized precursors. IEEE Trans. Semiconduct Manuf. 2013; 26,17-22.

R Solanki and B Pathangey. Atomic layer deposition of copper seed layers. Electrochem. Solid-State Lett. 2000; 3, 479-80.

K Weiss, S Riedel, SE Schulz, M Schwerd, H Helneder, H Wendt and T Gessner. Development of different copper seed layers with respect to the copper electroplating process. Microelectron. Eng. 2000; 50, 433-40.

U Emekli and AC West. Simulation of the effect of additives on electrochemical nucleation. J. Electrochem. Soc. 2010; 157, D479-D485.

U Emekli and AC West. Simulation of electrochemical nucleation in the presence of additives under galvanostatic and pulsed plating conditions. Electrochim. Acta 2010; 56, 977-84.

S Kim and DJ Duquette. Nucleation characteristics of directly electrodeposited copper on TiN. J. Electrochem. Soc. 2006; 153, C673-C676.

MJ Willey and AC West. Microfluidic studies of adsorption and desorption of polyethylene glycol during copper electrodeposition. J. Electrochem. Soc. 2006; 153, C728-C734.

S Nakahara. Microporosity in thin films. Thin Solid Films 1979; 64, 149-61.

M Schlesinger and M Paunovic. Modern Electroplating. Vol. 55. John Wiley & Sons, USA, 2011, p. 433-46.

L Yang, A Radisic, M Nagar, J Deconinck, PM Vereecken and AC West. Multi-scale modeling of direct copper plating on resistive non-copper substrates. Electrochim. Acta 2012; 78, 524-31.

Downloads

Published

2016-06-16

How to Cite

SUMRUNRONNASAK, S., TANTAYANON, S., & KIATGAMOLCHAI, S. (2016). Corrective Estimation of Copper Deposition Density onto Stainless Steel Substrate by Electroplating. Walailak Journal of Science and Technology (WJST), 14(5), 369–376. Retrieved from https://wjst.wu.ac.th/index.php/wjst/article/view/1959